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AS1115
Datasheet - A b s o l u t e M a x i m u m R a t i n g s
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only, and functional operation of
the device at these or any other conditions beyond those indicated in Section 6 Electrical Characteristics on page 4 is not implied.
Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Table 2. Absolute Maximum Ratings
Parameter
Min
Max
Units
Comments
Electrical Parameters
VDD to GND
All other pins to GND
DIG0:DIG7 Sink Current
SEGA:SEGG, SEGDP Sink Current
-0.3
-0.3
7
7 or
V DD + 0.3
500
100
V
V
mA
mA
Input Current (latch-up immunity)
-100
100
mA
Norm: JEDEC 78
Electrostatic Discharge
Electrostatic Discharge HBM
+/- 1
kV
Norm: MIL 883 E method 3015
Thermal Information
Thermal Resistance Θ JA
88
30.5
°C/W
°C/W
on PCB, QSOP-24 package
on PCB, TQFN(4x4)-24 package
Temperature Ranges and Storage Conditions
Junction Temperature
+150
oC
Storage Temperature Range
-55
+150
oC
The reflow peak soldering temperature (body temperature)
specified is in accordance with IPC/JEDEC J-STD-
Package Body Temperature
+260
oC
020“Moisture/Reflow Sensitivity Classification for Non-
Hermetic Solid State Surface Mount Devices”.
The lead finish for Pb-free leaded packages is matte tin
(100% Sn).
Humidity non-condensing
5
85
%
Moisture Sensitive Level
www.austriamicrosystems.com/LED-Driver-ICs/AS1115
1
Revision 1.08
Represents a max. floor life time of unlimited
3 - 25
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